Heidelberg weekly meeting

Europe/Zurich
03.410 (Physikalisches Institut, Heidelberg)

03.410

Physikalisches Institut, Heidelberg

Description

We will have the meeting in HeiCONF: https://heiconf.uni-heidelberg.de/sch-nqu-dd2   Access Code: 858824

Vidyo will be used as a back-up. Room extension 10823320 or use this link.

 

Tentative minute taker list at https://docs.google.com/spreadsheets/d/15oo_a_1WPxPBOtlH0LDEKG1128y1O2lfswpUAvPCQOY/edit#gid=0

    • 14:00 14:45
      Round Table 45m

      Reports of work progress

      Speakers: Adrian Herkert (Physikalisches Institut, Uni Heidelberg), Alena Weber (Universität Heidelberg), Andre Schoening (University Heidelberg, Institute of Physiscs), Annie Meneses Gonzalez (PhD Student), Benjamin Weinläder (PI Heidelberg), David Maximilian Immig (Universität Heidelberg), Dohun Kim (Physikalisches Institut University of Heidelberg), Frank Meier Aeschbacher (Universität Heidelberg), Heiko Augustin (PI Uni Heidelberg), Lars Noehte (PI Heidelberg), Luigi Vigani (University of Oxford), Lukas Mandok (Physikalisches Institut Heidelberg), Marius Menzel, Sebastian Dittmeier (Physikalisches Institut, Universität Heidelberg), Sebastian Preuß (PI Uni Heidelberg), Thomas Theodor Rudzki (Physikalisches Institut Heidelberg)

      Present: Andre, Luigi, Heiko, Testbeam crew (present only at the beginning for their report) (Annie, Benni, David, Jan),  Alex, Alena, Dohun, Frank, Konstantin, Lennhart, Thomas.

      Minute taker: Annie for testbeam report, then Luigi.

       

      Tets beam status:
      Telescope working, takin data after the meeting, tile not working, David is working in the sorting in the data, correlation in time and space, Heiko will glue and get bonded new sensors, look like the breakdown problems of the sensors is coming from the bond in the test points.

      Andre: Waiting answer about the possponing of comission to the begining of next year.  

      Sebastian Preuss presented: Sr90 irradiation of Mupix8. Started taking data last Friday. Significant increase in current not observed.

      Heiko: 8 more Run2020 chips to be bonded. Asked Ralf for minimal bonding to check if too many bonds destroy the chips. Checked more Run2020 chips, excluded problems on insert, similar behaviour observed. All chips outside the testbeam then declared dead. Problem might be in deep p-well. Cannot exclude that bonding destroyed the sensors.

      Alena: started testing hit counter chip on Monday. Nice. 3 chips show AmpOut, can be configured. Adder observed counting. Andre: where were chips diced? Karlsruhe.

      Alex: Probecard testing. Issues with Motherboard. It should be done today. 6-chip modules arrived. Working on adapter card. Can be done in 2 weeks.

      Dohun: writing thesis.

      Frank: no news from yesterday's collaboration meeting. Switzerland will announce soon new restrictions for Covid crisis. Might apply home office and travel restrictions. This would impact our testbeam plans. Can't do much about it.

      Konstantin: writing code. More correlations to be inspected.

      Lennhart: sensor from HD broken. New sensor works. All set up. Next week put v2 sensor in MIMOSA telescope. Rest of crew will use v5. Some hardware limitations.

      Thomas: after thermomecanical Mockup failure, found the problem in HDI-interposer flex bonds. Decided to dissemble and re-assemble (high risk). Done with L1 barrels. Worked out. Contacts work again. 2 half shells out of 4 done. Rest will be done after HighRR lecture week. Scheduled tests in Brugg in 2 weeks. Let's see. Reason for failure: bonding parameters not optimal, visual inspection might have found out. If one tries connectivity only, it works at first but it is not a good check. Larger microscope would be needed (3D view even better). Frank: with binocular optical microscope it will be easy. Andre: might be more of a problem for Oxford. Frank: not that much, just a factor of 3. Thomas: OK. When Alex and Luigi test chips ready to build modules.

      Andre: what about new wafers to be thinned. Luigi: with the wafers we have we can tolerate a yield down to 60%. Andre: other groups want them. Heiko: possibility of doing. Andre: let's check offline.

      Luigi: worked with Alex. Now that PCB arrived will double-check that CAD models are OK to validate mechanical support structure with workshop.

    • 14:45 14:55
      AOB