Heidelberg weekly meeting

Europe/Zurich
03.410 (Physikalisches Institut, Heidelberg)

03.410

Physikalisches Institut, Heidelberg

Description

We will have the meeting in HeiCONF: https://heiconf.uni-heidelberg.de/sch-nqu-dd2   Access Code: 858824

Vidyo will be used as a back-up. Room extension 10823320 or use this link.

 

Tentative minute taker list at https://docs.google.com/spreadsheets/d/15oo_a_1WPxPBOtlH0LDEKG1128y1O2lfswpUAvPCQOY/edit#gid=0

    • 14:00 14:45
      Round Table 45m

      Reports of work progress

      Speakers: Adrian Herkert (Physikalisches Institut, Uni Heidelberg) , Alena Weber (Universität Heidelberg) , Andre Schoening (University Heidelberg, Institute of Physiscs) , Annie Meneses Gonzalez (PhD Student) , Benjamin Weinläder (PI Heidelberg) , David Maximilian Immig (Universität Heidelberg) , Dohun Kim (Physikalisches Institut University of Heidelberg) , Frank Meier Aeschbacher (Universität Heidelberg) , Heiko Augustin (PI Uni Heidelberg) , Lars Noehte (PI Heidelberg) , Lennart Huth (PI Heidelberg) , Luigi Vigani (University of Oxford) , Lukas Mandok (Physikalisches Institut Heidelberg) , Marius Menzel, Sebastian Dittmeier (Physikalisches Institut, Universität Heidelberg) , Sebastian Preuß (PI Uni Heidelberg) , Thomas Theodor Rudzki (Physikalisches Institut Heidelberg)
      • Talk Lennart
      • Chips from run 2020 seem to be noisy at HD and DESY
      • Heiko:
        • Noise candidate: new in comparison to previous chips: VCasc of the amplifier can be supplied from the outside, before it was generated on chip. Maybe this new access causes the noise. Be careful with VCasc settings.
        • Single chips thinning seems to be possible, but optim has only/more experience with small chips (mm size)
      • Andre:
        • Get chips back on tape, test them, then try to get them off the tape
      • Slide IV Curve for 50um MuPix10
        • early breakdown overserved
        • has to be understand
      • Andre:
        • assuming: not due to the thinning
        • big issue, not ready for production, high priority
        • start with 100um wafers
      • Heiko:
        • Thinned chips have scratches
        • send chips to irradiate them tomorrow, maybe they are back before Christmas
      • Sebastian D:
        • DAQ issue hackathon Friday 18.12 and Monday 21.12
        • preparing for the hackathon
      • Alena:
        • working on analysis test beam data from HIT
      • Benjamin:
        • designed two PCBs for Thomas
        • PCBs are for connecting two HDIs to do tests with 24cm HDI flexprints
      • David:
        • busy with lab courses
        • new sorter finished
        • test sorter
        • look at MuPix10 test beam data
      • Dohun:
        • preparation of alpha source measurement
      • Florian:
        • search threshold voltage for tiles
        • actual problem: noise
      • Jan:
        • @Florian: known noise, caused by after-pulses due to too high HV
      • Konstantin:
        • preparing colloquium
      • Marius:
        • work on FPGA implementation of noise tuning
        • preparing colloquium
      • Luigi:
        • busy with TDR
        • workshop: handover adapter card design
        • checking for the cables, moles doesn’t offer twisted cables, don’t support small custom projects
        • Possible to use HDMI cable? For this the board has to be modified (different pinning)
        • Maybe not an option because we have many signals but for this many HDMI cables would be needed
    • 14:45 14:55
      AOB