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Description
Zoom [link] Task tracking: [Mattermost Board]
Key Outcomes
The meeting covered hardware QC workflows across Vertex and Outer Pixel, stiffener redesign progress, and post-extraction logistics. A key decision was reached to proceed with physical prototyping of the new stiffener design rather than continue theoretical discussion. Post-extraction QC testing of Outer Pixel modules at PSI before shipment to Liverpool was strongly recommended by multiple participants, though timeline and staffing constraints remain unresolved.
General news: New meeting time commencing next week: Fridays 11am (CET)
Decisions Made
- Stiffener prototyping: Proceed with making testable prototypes of the new U-profile carbon fiber stiffener design; outcome of engineering meeting next week will be reported back.
- Two stiffener approaches remain open: (1) stiffener stopping at the interposer flex; (2) stiffener extending into the end-piece clamp region — both to be discussed with engineers (Robert, Matt, Adam?) next week.
- Glue strategy: Minimum-glue approach acknowledged as likely insufficient; adding more glue at the end region identified as a potential fix for stiffener detachment.
- Outer Pixel modules: Most modules return to Liverpool (carried by Matt, not shipped); one module stays at PSI as a reference.
- Layer 3 current ladders: No immediate repair action decided; leaving them as-is is a valid option if they remain functional.
- Multimeter probing method: For DataOut, use 100s-of-ohms range (expect 200–230 Ω); for serial-in and clock lines, use protection-diode mode until best practice is confirmed.
Completed
- New curing weights fabricated to accommodate wider flex geometry.
- Probe station automation code written by Aliki: loops through chips, identifies probe location, runs full QC — pending auto-alignment refinement and new probe card installation.
- Liverpool QC setup: Mapping corrected from VSX to OP pixel module; pending confirmation of additional FEB from Nick. Then also waiting for module, Matt will build ~ end of next week after he collects spare ladders from OX on Tuesday (3rd Nov).
Blockers
- Vertex extraction timing depends on SciFi coming out first; on-cage diagnostics planned for ~1 week before disassembly.
- QC re-testing timeline at PSI is tight: loading/unloading modules previously took much longer than one week; new clamp designed by Matt could reduce connection time to ~10 minutes vs. half a day.
- LTU new HPIs: Delayed due to email system outage at HD; ground routing around VDD lines more complex than expected — a few extra days needed.
- Air compressor replacement: Timing unconfirmed; Alex to follow up with Daniel (OPMD).
Pending Confirmation
- Whether one week is sufficient for full Outer Pixel module re-QC at PSI before Matt carries them to Liverpool.
- Sultan's availability to test the new probe card in ~two weeks.
- New chip tester onboarding: finance and safety forms still outstanding; training not yet scheduled (~10 days expected).
- Heidelberg single-chip clean room revival: no progress.
- Matt's new module clamp: design complete, sent for machining — timeline can be pushed if needed.
- Whether a spare probe card PCB should be ordered given risk of needle damage during automation learning; to be confirmed once tested that it’s working well.
Open Questions
- Whether probing serial-in and clock lines with standard resistance mode risks chip damage — under investigation.
- Whether stiffener detachment on current Layer 3 ladders is due to operational stress or pre-existing; inspection of extracted modules will provide data.
- Removing possibility for He flow through stiffener v-folds confirmed as not a concern by Matt and Joey (this relates to the possible additional piece to glue onto existing L3 ladders to reinforce end region).
Action Items
- Alex: Share updated stiffener model with Matt; present engineering meeting outcome to this meeting next week (Friday).
- Alex: Investigate air compressor replacement schedule with Daniel.
- Ashley: Check with Adam (Brick Kiln) about attending next week's engineering meeting and bringing prototype samples.
- Matt: Push machining of new module clamp; test clamp on mechanical module next week before extraction week.
- Matt: Take ladders from Oxford on Tuesday; complete Liverpool handoff before end of next week or start of following week (before holiday).
- Joey/Matt: Explore training Joey (or others) to load modules into QC box to reduce single-point dependency on Matt.
- Aliki: Complete auto-alignment work on probe station; coordinate with Sultan offline on probe card test timing.
- Jak: Follow up with Nik on additional FEB; recommission Liverpool QC setup when Matt returns with new module.
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