Heidelberg weekly meeting

03.410 (Physikalisches Institut, Heidelberg)


Physikalisches Institut, Heidelberg


For Vidyo please use room extension 10823320 or use this link.

    • 14:00 14:45
      Round Table 45m

      Reports of work progress

      Speakers: Adrian Herkert (Physikalisches Institut, Uni Heidelberg), Alena Weber (Universität Heidelberg), Andre Schoening (University Heidelberg, Institute of Physiscs), Annie Meneses Gonzalez (PhD Student), Benjamin Weinläder (PI Heidelberg), David Maximilian Immig (Universität Heidelberg), Frank Meier Aeschbacher (Universität Heidelberg), Heiko Augustin (PI Uni Heidelberg), Jan Hammerich (PI Heidelberg), Lars Noehte (PI Heidelberg), Luigi Vigani (University of Oxford), Sebastian Dittmeier (Physikalisches Institut, Universität Heidelberg), Thomas Theodor Rudzki (Physikalisches Institut Heidelberg)

      Present: Jan, Heiko, Sebastian, Andre, Annie, Thomas, Frank, Luigi, David

      Minute-taker: David



      • submitted ATLASpix3 insert and ordered SMD parts (should both arrive next week, not all capacities available for 200V specification)
      • PCBs can be populated end of september/ begin of october
      • did a documentation on ATLASpix3 insert (link: https://www.physi.uni-heidelberg.de/Forschung/he/mu3e/wiki/index.php/ATLASPix3)
      • mechanical support for bonding and protection cap have to be designed and produced (dimensions in documentation)
      • ordered 20 insert and asked for over production
      • bill of materials and box of components with Jan
      • Diddie: readout chain prepared but has to be tested


      • working on slow control
      • prepares information for the reviewers
      • working with Annie and Lars (will comment themselves)


      • working with Heiko on pixel structure
      • nwell 50x50 um²: not fully depleted @ -60V at corners in 3D-simulation
      • Andre: agenda for next friday -> size of n-well/depletion/breakdown
      • 63x63 um n-well design is baseline, can be reduced if higher breakdown voltages would be considered


      • working on testbeam preparation: newly bonded irrad. MuPix7, and MuPix9
      • will test software for bugs with Jan


      • working with Adrian setting up water cooling test for FEB

      Heiko for Lars;

      • successfully bonded flexprint on support PCB and get it running at full speed
    • 14:45 14:55