Dr
Fabian Hügging
(University of Bonn)
06/07/2012, 13:30
Interconnect and sensor technologies
Interconnection technologies are important for compact modern tracking detectors. Recently new developments come to the focus which allow a wide variety of new detector layouts and arrangements. Among these are fine pitch bump bonding with pitches down to 50µm and below and Through Silicon Via (TSV) conncetion through the electronics layer of hybrid pixel detector. Real 3D integration of...
Prof.
Paul Sellin
(University of Surrey)
06/07/2012, 13:55
Interconnect and sensor technologies
High-Z semiconductor materials have considerable potential for use as room temperature X-ray and gamma ray detectors, combining good spectral resolution with high quantum efficiency. For many years germanium has been the only readily available high-Z detector material, however recent improvements in compound semiconductor materials such as CZT means that room temperature high-Z detectors are...
