3–7 Jul 2011
ETH Zurich, Switzerland
Europe/Zurich timezone

In situ analysis of carrier lifetime and barrier capacitance variations in silicon during 1.5 MeV protons implantation

4 Jul 2011, 12:36
1m
HG E7 (ETH Zurich, Switzerland)

HG E7

ETH Zurich, Switzerland

www.ethz.ch www.psi.ch
Poster presentation Sensor Materials, Device Processing & Technologies Poster MiniTalks I

Speaker

Mr Tomas Ceponis (Vinius University, Institute of Applied Research)

Description

Ion implantation technology is commonly employed for modification of material properties, device structures, as well as for introducing fast recombination centers in microelectronic, nanoelectronic and optoelectronic devices. Despite beneficial recombination centers, detrimental defects that affect the device operation are introduced during implantation as well. Therefore, it is essential to analyze the characteristics of these defects. Usually, combined analysis of current-voltage (I-V), capacitance-voltage (C-V), deep level transient spectroscopy (DLTS), transient current technique (TCT) characteristics is employed for investigation of radiation induced defects. However, these techniques are applied in the post irradiated state and do not provide direct information of defects creation processes. Therefore, in situ techniques, capable to reveal the peculiarities of defects creation during ion implantation, are desirable. In this work, results of the in situ analysis of recombination lifetime and barrier capacitance variations in Si substrates and pin diodes, respectively, during 1.5 MeV protons implantation are presented. Carrier recombination lifetime has been measured by employing microwave probed photoconductivity method (MW-PCD), while parameters of barrier capacitance changes have been extracted by transient technique of barrier capacitance charging current measurements using linearly increasing voltage pulses. Sub-linear decrease of carrier lifetime as a function of fluence has been revealed and peculiarities of such characteristic are explained in terms of formation of two layered structure within implanted Si material. Barrier capacitance variations in pin diode structures during 1.5 MeV protons implantation are discussed.

Primary author

Mr Tomas Ceponis (Vinius University, Institute of Applied Research)

Co-authors

Mr Aurimas Uleckas (Vinius University, Institute of Applied Research) Dr Eugenijus Gaubas (Vinius University, Institute of Applied Research) Prof. Juozas Vaitkus (Vinius University, Institute of Applied Research) Mr Kestutis Zilinskas (Vinius University, Institute of Applied Research) Dr Mindaugas Gaspariunas (Centre for Physical Sciences and Technology) Prof. Vidas Remeikis (Centre for Physical Sciences and Technology)

Presentation materials