Conveners
Sensor Materials, Device Processing & Technologies II: 2 contributions
- Val O'Shea (University of Glasgow)
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Thomas Fritzsch (IZM Dept. High Density Interconnect & Wafer Level Packaging)04/07/2011, 16:25Oral presentationWafer level packaging processes has been used over several years in hybrid pixel module manufacturing. Deposition processes like electroplating, sputtering as well as evaporation are well established technologies for the formation of interconnection structures on readout chip wafers as well as on sensor wafers. Following the packaging roadmaps to higher integration, increased functionality...Go to contribution page
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Dr Hidenori Toyokawa (Japan Synchrotron Radiation Research Institute)04/07/2011, 17:00Sensor Materials, Device Processing & TechnologiesOral presentationSingle X-ray photon counting pixel detector was expected to be a next generation 2D X-ray detector from the early stage of the third generation synchrotron radiation facilities. In fact, silicon-based hybrid pixel detectors such as PILATUS became commercially practical. To improve the detection sensibility in the high energy X-ray region, cadmium telluride (CdTe) is regarded as a promising...Go to contribution page
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Dr Michael Fiederle (Freiburger Materialforschungszentrum FMF)04/07/2011, 17:20Sensor Materials, Device Processing & TechnologiesOral presentationThe development of pixel detector arrays for different types of applications requires sensors with high efficiency and high homogeneity. The efficiency is strongly depending on the absorption of the detector material. High-Z semiconductors like CdTe-based materials are the most promising ones. The recent progress of CdTe crystals and the availability of interconnection technology open the...Go to contribution page