Conveners
Sensor Materials, Device Processing & Technologies II: 2 contributions
- Val O'Shea (University of Glasgow)
Thomas Fritzsch
(IZM Dept. High Density Interconnect & Wafer Level Packaging)
7/4/11, 4:25 PM
Oral presentation
Wafer level packaging processes has been used over several years in hybrid pixel module
manufacturing. Deposition processes like electroplating, sputtering as well as evaporation are
well established technologies for the formation of interconnection structures on readout chip
wafers as well as on sensor wafers. Following the packaging roadmaps to higher integration,
increased functionality...
Dr
Hidenori Toyokawa
(Japan Synchrotron Radiation Research Institute)
7/4/11, 5:00 PM
Sensor Materials, Device Processing & Technologies
Oral presentation
Single X-ray photon counting pixel detector was expected to be a next generation 2D X-ray detector from the early stage of the third generation synchrotron radiation facilities. In fact, silicon-based hybrid pixel detectors such as PILATUS became commercially practical. To improve the detection sensibility in the high energy X-ray region, cadmium telluride (CdTe) is regarded as a promising...
Dr
Michael Fiederle
(Freiburger Materialforschungszentrum FMF)
7/4/11, 5:20 PM
Sensor Materials, Device Processing & Technologies
Oral presentation
The development of pixel detector arrays for different types of applications requires sensors with high efficiency and high homogeneity. The efficiency is strongly depending on the absorption of the detector material. High-Z semiconductors like CdTe-based materials are the most promising ones. The recent progress of CdTe crystals and the availability of interconnection technology open the...
