Speaker
Description
Femtosecond laser direct writing (LDW) using ultraviolet, visible or infrared lasers is a maskless subtractive manufacturing approach that is widely used for precision surface processing due to the strong spatial confinement of laser energy it provides and the minimal collateral damage it causes. Here, we present a conceptual scheme for high-precision machining of semiconductor materials using LDW with sub-micron-focused extreme ultraviolet (EUV) laser pulses. A proof-of-concept study was conducted at the SACLA free-electron laser facility, confirming the feasibility of the machining by creating reproducible craters with similar geometries in single EUV laser shots under fixed pulse parameters. The trends observed in the experiment were reproduced by theoretical simulations. These results clearly demonstrate the potential for controlled and reproducible semiconductor surface machining at the sub-micron length scale [1]. The proposed EUV LDW approach could pioneer transformative, cost-efficient manufacturing technology enabling direct, sub-micron- to nanometer-scale patterning of semiconductors and other technologically relevant materials.
[1] V. Lipp, G. Yamaguchi, S. Egawa et al., submitted to Scientific Reports.
| Scientific Topics | Solid State Physics |
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